Tata Electronics’ ₹27,000-crore semiconductor assembly and testing facility in Jagiroad, Assam, has begun pilot activity, marking progress towards expanding India’s chip packaging capacity for automotive, mobile, communications, computing and AI applications.
Tata Electronics has begun pilot activity at its ₹27,000-crore semiconductor assembly and test (OSAT) facility in Jagiroad, Assam, as the company advances plans to expand India’s semiconductor packaging and testing capacity.
The facility, being developed by Tata Electronics, a wholly owned subsidiary of Tata Sons, is designed to process up to 48 million semiconductor chips per day upon commissioning, according to the Press Information Bureau. The company announced the investment in February 2024.
The plant will use Wire Bond, Flip Chip and Integrated Systems Packaging (ISP) technologies. Its target applications include automotive, mobile devices, communications, computing, artificial intelligence (AI) and consumer electronics, positioning the facility to serve both Indian and international customers.
The project is expected to generate more than 27,000 direct and indirect jobs, according to Tata Electronics’ original announcement. The facility is also intended to support the development of a semiconductor manufacturing supply chain in Northeast India.
In October 2026, Assam Chief Minister Himanta Biswa Sarma highlighted the facility’s progress and described the project as a game-changer for the state. He also credited Prime Minister Narendra Modi with supporting the initiative.
The Jagiroad facility is an assembly, packaging and testing plant, rather than a wafer fabrication unit. These operations form a key part of the semiconductor value chain, preparing chips for use in electronic products.
The investment marks a major addition to India’s domestic semiconductor packaging ambitions, with the plant planned to serve customers across several electronics sectors.
Source: www.electronicsforyou.biz
