Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated semiconductors.
The Tokyo-based company said on Friday that it would add production lines for mould underfill (MUF) materials and compression-moulding granules at its facilities in Suzhou, eastern…
Source: www.scmp.com
