China’s memory chip giant ChangXin Memory Technologies (CXMT) has reported “key progress” in a new structure that rivals Samsung Electronics and SK Hynix are also working on to boost memory density.
CXMT planned to roll out a new server-memory product based on the structure by the end of 2026, president Cao Kanyu said at an industrial event in Shanghai over the weekend, according to a company statement.
At the centre of the development is the “4F square” design, in which each memory cell…
Source: www.scmp.com
