Broadcom Inc (NASDAQ:AVGO, XETRA:1YD) is arranging more than $50 billion in financing for custom artificial intelligence (AI) chips it is developing with OpenAI, as demand for computing capacity drives increasingly large funding deals.
Apollo Global Management (NYSE:APO) and Blackstone are among the lenders Broadcom has approached, with discussions at an early stage and the size of the financing potentially subject to change, Bloomberg reports.
The chips are being developed under OpenAI‘s Nexus program, part of a plan announced by the companies in October 2025 to deploy 10 gigawatts of custom AI accelerators by the end of 2029.
The proposed financing would add to Broadcom’s growing role in arranging capital for AI infrastructure projects, with the company pursuing funding tied to its largest AI customers.
Broadcom completed a $35 billion financing partnership with Apollo and Blackstone in June to expand computing capacity for Anthropic, another major AI company.
Broadcom has also been involved in a separate financing package for Anthropic that was initially reported at more than $60 billion, with banks beginning to syndicate a $60 billion package in October.
The Anthropic package includes $42 billion of senior debt backed by Broadcom and $18 billion of junior debt without Broadcom guarantees, according to the report cited in the source material.
The latest discussions follow an $18 billion financing problem for OpenAI’s chip project reported in May, adding another funding challenge as the company seeks to build large-scale computing infrastructure.
Broadcom’s financing efforts for Anthropic and OpenAI illustrate the growing scale of capital required to build the data centers and specialized chips needed to support increasingly demanding AI systems.
The completed $35 billion Anthropic financing, the reported $60 billion package for the same company and the proposed OpenAI financing would together represent more than $145 billion of potential and completed funding arrangements.
Source: ca.finance.yahoo.com
